EPF10K200SBC600-1 vs EPF10K200EBI600-2 Vergleich

Detaillierter Direktvergleich von EPF10K200SBC600-1 von Intel und EPF10K200EBI600-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K200SBC600-1 EPF10K200EBI600-2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $425,00 $198,00
Family FLEX-10KS FLEX 10KE
Series EPF10K200 —
Logic Elements / Cells 9,984 —
Gate Count (typical) 200,000 gates —
Logic Array Blocks (LABs) 1,248 1,248
Number of User I/Os 470 —
Number of Logic Cells 4,992 —
Embedded RAM (bits) 24,576 (across EABs) —
Max Internal Frequency 250 MHz —
Propagation Delay 0.4 ns 0.4 ns (per -2 speed grade)
Process Technology 0.22 µm CMOS —
Core Supply Voltage (VCCINT) 2.375 V to 2.625 V (typ. 2.5 V) —
Speed Grade -1 (fastest commercial) —
Betriebstemperatur 0 °C to 70 °C (Commercial) 0 C to 70 C (commercial)
Gehäuse 600-ball BGA, 45 × 45 mm, 1.27 mm pitch BGA-600, 45 x 45 mm, 1.27 mm pitch
Montageart Surface Mount Surface Mount (BGA)
JTAG Support IEEE Std 1149.1 —
Configuration Serial via EPC2/EPC8 configuration devices —
RoHS-Status Non-compliant (per third-party listing) Compliant (lead-free package)
System Gates — 200,000
Logic Elements (LEs) — 9,984
Embedded RAM — 98,304 bits
Embedded Array Blocks (EABs) — 12 (typical for this density)
User I/O Pins — 470
Supply Voltage (VCCINT) — 2.5 V
Logic Family — CMOS, SRAM-based
Configuration Method — JTAG / ByteBlaster (SRAM configuration)

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