EPF10K200SFC484-3 vs EPF10K200SFC484-1X Vergleich
Detaillierter Direktvergleich von EPF10K200SFC484-3 von Intel und EPF10K200SFC484-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
EPF10K200SFC484-3 ObsoleteSpezifikationsvergleich
| Parameter | EPF10K200SFC484-3 | EPF10K200SFC484-1X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $142,00 |
| Series | FLEX-10KS | FLEX 10KS |
| Family | FLEX 10K | FLEX 10K Embedded Programmable Logic Device |
| System Gates | 200,000 | — |
| Logic Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| User I/O Pins | 369 | — |
| Core Voltage | 2.375 V to 2.625 V | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Maximum Internal Frequency | 166.67 MHz | 250 MHz |
| Embedded Memory (RAM bits) | 40,960 (via EABs) | — |
| Global Clock Networks | 4 | — |
| Gehäuse | 484-Ball FineLine BGA (PBGA484) | 484-BBGA / FBGA-484 (23 x 23 mm, 1.0 mm pitch, fine line) |
| Package Dimensions | 23 mm × 23 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Configuration Method | SRAM, JTAG, EPC2 PROM | — |
| I/O Standards | 3.3 V LVTTL/LVCMOS, 5.0 V PCI | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Status | Obsolete (last shipped 2007-2010, available via brokers) | — |
| Logic Elements / Cells | — | 9984 |
| Total RAM Bits | — | 98304 |
| Number of LABs/CLBs | — | 1248 |
| User I/O Count | — | 369 |
| Supply Voltage (Core) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Propagation Delay | — | 0.4 ns |