EPF10K200SFC672-1X vs EPF10K200SFI672-2B Vergleich
Detaillierter Direktvergleich von EPF10K200SFC672-1X von Intel und EPF10K200SFI672-2B von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K200SFC672-1X | EPF10K200SFI672-2B |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $135,00 | $188,00 |
| Series | FLEX-10KS | — |
| Family | FLEX 10K (legacy) | FLEX 10KE |
| Architecture | Reconfigurable CMOS SRAM | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gate count] | 513,000 |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded Array Blocks (EABs) | 24 | 24 (96 Kbits total) |
| Embedded RAM Bits | 98,304 | — |
| User I/O Pins | 470 | — |
| Propagation Delay | 0.4 ns | — |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) | 2.5 V |
| JTAG Support | IEEE Std. 1149.1 (adds up to 31,250 gates) | — |
| Betriebstemperatur | 0 °C to 70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Gehäuse | 672-ball FineLine BGA, 27 × 27 mm, 1.0 mm pitch | FBGA-672 (FineLine BGA, 27 × 27 mm, 1.0 mm pitch) |
| Montageart | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Configuration Method | SRAM (volatile, reconfigurable at every power-up) | — |
| Design Tool | Quartus (legacy FLEX 10K support) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Non-compliant (legacy FLEX 10KE) |
| Logic Elements | — | 9,984 |
| System Gates | — | 200,000 |
| Embedded Memory | — | 98,304 bits |
| User I/Os | — | 470 |
| Process Technology | — | 0.22 µm CMOS, SRAM |
| Maximum Operating Frequency | — | 200 MHz |
| PLLs | — | 4 |
| Programming Memory Type | — | SRAM |