EPF10K200SRC240-2 vs EPF10K200SRC240-3 Vergleich
Detaillierter Direktvergleich von EPF10K200SRC240-2 von Intel und EPF10K200SRC240-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K200SRC240-2 | EPF10K200SRC240-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $62,50 | $132,00 |
| Series | FLEX 10KS | FLEX-10KS |
| Family | FLEX 10KS (FLEX 10KE/10KA generation) | FLEX 10KE |
| Number of Logic Elements (LEs) | 9984 | — |
| Number of Logic Array Blocks (LABs) | 1248 | — |
| Total RAM Bits | 98304 | 98,304 |
| Number of User I/Os | 182 | — |
| Number of Gates | 513000 | — |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Betriebstemperatur | 0C to +70C (Commercial, TA) | 0 C to 70 C (Commercial) |
| Gehäuse / Bauform | 240-BFQFP Exposed Pad (240-RQFP, 32x32 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 240 | — |
| Speed Grade | -2 (~80 MHz internal, typical) | — |
| Configuration Interface | IEEE 1149.1 JTAG + Altera EPC EEPROM | — |
| Process Technology | 0.42 micrometer CMOS SRAM | 0.22 um CMOS |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 9984 |
| Total System Gates | — | 200,000 |
| Number of LABs/CLBs | — | 1248 |
| Number of I/Os | — | 470 |
| Number of DLLs | — | 4 |
| Gehäuse | — | 240-BFQFP Exposed Pad (RQFP-240) |
| Package Dimensions | — | 34.60 x 34.6 mm, 0.5 mm pitch |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant) |
| Maximum Internal Frequency | — | 166.67 MHz |
| Propagation Delay | — | 0.4 ns |