EPF10K250EBC600-3 vs EPF10K200SBC600-2 Vergleich
Detaillierter Direktvergleich von EPF10K250EBC600-3 von Intel und EPF10K200SBC600-2 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K250EBC600-3 | EPF10K200SBC600-2 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $85,00 |
| Family | FLEX 10KE | — |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | 200,000 |
| Maximum User I/O | 470 | — |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | Yes (for distributed RAM/ROM) |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | — |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | — |
| Gehäuse | 600-ball FineLine BGA | — |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | 0 C to 70 C |
| Process Technology | SRAM-based CMOS | 0.22 micrometer |
| Manufacturer | — | Altera (now Intel) |
| Series | — | FLEX-10KS |
| Logic Elements / Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| User I/Os | — | 470 |
| Propagation Delay | — | 0.4 ns |
| Voltage - Supply (VCCINT) | — | 2.375 V to 2.625 V |
| Montageart | — | Surface Mount |
| Gehäuse / Bauform | — | 600-BGA (45 x 45 mm, 1.27 mm pitch) |
| Supplier Device Package | — | 600-BGA |
| Logic Family | — | CMOS (SRAM-based) |
| PLLs | — | 4 |
| Configuration Interface | — | IEEE 1149.1 JTAG |
| MultiVolt I/O | — | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) |
| Packaging | — | Bulk / Tray |
| RoHS-Status | — | Non-compliant |