EPF10K250EBI600-3 vs EPF10K200SBC600-2 Vergleich
Detaillierter Direktvergleich von EPF10K250EBI600-3 von Intel und EPF10K200SBC600-2 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EPF10K250EBI600-3 | EPF10K200SBC600-2 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $110,00 | $85,00 |
| Family | FLEX 10KE | — |
| Logic Elements | 12,160 | — |
| Typical Gate Count | 250,000 system gates | — |
| Embedded System Blocks (ESBs) | 12 | — |
| Maximum User I/O | 470 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | 4 |
| On-chip RAM | Up to 40 Kbits | — |
| Gehäuse | 600-ball BGA (HBGA) | — |
| Ball Pitch | 1.93 mm | — |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | — |
| Betriebstemperatur | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | 0 C to 70 C |
| Speed Grade | -3 (fastest) | — |
| Process Technology | 0.22 µm CMOS, 4-layer metal | 0.22 micrometer |
| Configuration Method | SRAM, requires external configuration device (EPC series) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Not specified (SnPb / tin-lead finish per legacy distributor listing) | Non-compliant |
| Lead-free | no (legacy tin-lead per distributor description) | — |
| Manufacturer | — | Altera (now Intel) |
| Series | — | FLEX-10KS |
| Logic Elements / Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Propagation Delay | — | 0.4 ns |
| Voltage - Supply (VCCINT) | — | 2.375 V to 2.625 V |
| Gehäuse / Bauform | — | 600-BGA (45 x 45 mm, 1.27 mm pitch) |
| Supplier Device Package | — | 600-BGA |
| Logic Family | — | CMOS (SRAM-based) |
| Embedded Array Blocks (EABs) | — | Yes (for distributed RAM/ROM) |
| Configuration Interface | — | IEEE 1149.1 JTAG |
| MultiVolt I/O | — | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) |
| Packaging | — | Bulk / Tray |