EPF10K30EFC256-3 vs EPF10K30EFC256-1 Vergleich
Detaillierter Direktvergleich von EPF10K30EFC256-3 von Intel und EPF10K30EFC256-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K30EFC256-3 | EPF10K30EFC256-1 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,60 | $69,50 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements / Cells | 1,728 | 1,728 |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| Gehäuse | 256-ball FineLine BGA | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Speed Grade | -3 (fastest) | -1 |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (verify per lot) |
| Series | — | FLEX 10KE |
| Total RAM Bits | — | 24,576 |
| Number of I/O | — | 176 |
| Number of Logic Gates | — | 119,000 |
| Voltage - Supply | — | 2.375 V to 2.625 V |
| Betriebstemperatur | — | 0C to +70C (Commercial) |
| Gehäuse / Bauform | — | 256-FBGA (17 x 17 mm, 1 mm pitch) |
| Supplier Device Package | — | 256-FBGA |