EPF10K30EFC256-3 vs EPF10K30EFC256-3N Vergleich
Detaillierter Direktvergleich von EPF10K30EFC256-3 von Intel und EPF10K30EFC256-3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K30EFC256-3 | EPF10K30EFC256-3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,60 | $58,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | 1,728 |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 um CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| Gehäuse | 256-ball FineLine BGA | 256-pin FineLine BGA (FBGA) |
| Montageart | Surface Mount (BGA) | — |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Gate Count | — | 30,000 gates |
| Embedded Array Blocks (EABs) | — | 6 |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/Os | — | 176 |
| Core Voltage | — | 2.5 V |
| I/O Standard Support | — | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Internal Frequency | — | 80 MHz (typical) |
| Propagation Delay (tPD) | — | 0.6 ns |
| Bidirectional I/O Performance | — | up to 212 MHz |
| PCI Compliance | — | PCI SIG 2.2 at 33 / 66 MHz |
| Betriebstemperatur | — | 0 C to +70 C (Commercial) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |
| Open-Drain I/O Option | — | Yes (per pin) |