EPF10K30ETC144-3N vs EPF10K50ETC144-3 Vergleich

Detaillierter Direktvergleich von EPF10K30ETC144-3N von Intel und EPF10K50ETC144-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K30ETC144-3N EPF10K50ETC144-3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $26,75 $29,90
Family FLEX 10KE FLEX 10KE
Logic Family CMOS CMOS
Typical Gates 30,000 —
Logic Elements / Cells 1,728 2,880
Logic Array Blocks (LABs) 216 360
Embedded Memory Bits 24,576 —
User I/Os 102 —
Anzahl der Pins 144 144
Package Type TQFP-144 (22 × 22 mm, 0.5 mm pitch) TQFP-144 (also referred to as 144-LQFP)
Package Code LFQFP —
Terminal Form Gull Wing —
Montageart Surface Mount Surface Mount
Technology 0.22 µm CMOS, SRAM-based —
Core Supply Voltage (VCCINT) 2.5 V —
Betriebstemperatur 0 °C to 70 °C (Commercial) 0 °C to +70 °C (Commercial)
Propagation Delay 0.6 ns (typical) 0.6 ns
Internal Frequency [DATA_NEEDED: internal frequency max] —
Programming Method JTAG (IEEE 1149.1), in-system SRAM configuration —
Configuration Memory Volatile SRAM (requires external configuration device) SRAM (volatile)
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
Typical Gate Count — 50,000 gates
Total Memory Bits — 40,960 bits
User I/O Pins (this package) — 102
Max User I/O (family) — 274 pins
Maximum Internal Frequency — 166.67 MHz
Internal Frequency (per DigChip summary) — 66.67 MHz
Process Technology — 0.22 µm CMOS
Core Supply Voltage — 2.5 V
JTAG Support — IEEE 1149.1 boundary scan

Datenblätter & Ressourcen

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