EPF10K50VRC240-2 vs EPF10K50VRC240-3N Vergleich
Detaillierter Direktvergleich von EPF10K50VRC240-2 von Intel und EPF10K50VRC240-3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K50VRC240-2 | EPF10K50VRC240-3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,95 | $58,75 |
| Family | Flex 10K | FLEX 10K (Altera / Intel) |
| Logic Cells | 2,880 | — |
| Typical Gates | 50,000 | 50,000 |
| Logic Elements (LEs) | 20,480 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| User I/Os | 189 | — |
| Embedded Array Blocks (EABs) | [DATA_NEEDED: EAB count and RAM bits] | — |
| Maximum Internal Frequency | 125 MHz | — |
| Propagation Delay | 0.6 ns | 0.6 ns (per digchip datasheet snippet) |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS, SRAM-based |
| Core Supply Voltage | 3.3 V | — |
| Speed Grade | -2 (mid) | -3 |
| Gehäuse | 240-pin RQFP / HFQFP (exposed pad), gull-wing | 240-RQFP (RQFP / Power QFP) with exposed pad |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (Commercial) |
| Configuration Memory | SRAM (volatile, external PROM required) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: confirm against manufacturer declaration] |
| Series | — | FLEX 10K |
| Logic Cells / Logic Elements | — | 2,880 |
| Embedded Array Bits | — | 20,480 bits (EABs) |
| Maximum User I/O | — | 189 |
| Core Voltage | — | 3.3 V |
| Internal Frequency (max) | — | 125 MHz |
| Configuration Method | — | SRAM, in-system programmable via JTAG / serial PROM |