EPF6010ATC100-3 vs EPF6016AFC100-3 Vergleich
Detaillierter Direktvergleich von EPF6010ATC100-3 von Intel und EPF6016AFC100-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF6010ATC100-3 | EPF6016AFC100-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,90 | $18,23 |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 880 | — |
| Usable Gates | 10,000 | — |
| Logic Array Blocks (LABs) | 88 | — |
| User I/O Pins | 71 | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 um CMOS |
| Supply Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage Tolerance | 3.3 V / 5 V tolerant | — |
| Speed Grade | -3 (commercial, slowest grade) | — |
| Gehäuse | TQFP-100 (100-pin) | 100-pin FineLine BGA (FBGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | SRAM (external configuration device required) | — |
| JTAG Support | Yes (IEEE 1149.1) | IEEE 1149.1 Boundary Scan |
| Betriebstemperatur | 0C to +70C (commercial) | 0 C to 85 C (Commercial) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | unknown |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Gates | — | 16,000 gates |
| Logic Cells | — | 1,320 cells |
| Maximum Internal Frequency | — | 142.86 MHz |
| User I/O | — | 81 |
| Versorgungsspannung | — | 3.3 V |
| Architecture | — | SRAM-based, 4-input LUT |
| Configuration Method | — | SRAM (in-system programmable) |