EPF6024AQC240-3 vs EPF6024AQC240-2 Vergleich
Detaillierter Direktvergleich von EPF6024AQC240-3 von Intel und EPF6024AQC240-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF6024AQC240-3 | EPF6024AQC240-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,80 | $23,10 |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | Loadable PLD / SRAM-based FPGA | — |
| Logic Cells | 1960 | — |
| Logic Array Blocks (LABs) | 196 | 196 |
| Typical Gate Count | 24,000 gates | — |
| User I/Os | 199 | 199 |
| Internal Frequency | 142.86 MHz | 166.67 MHz |
| Process Technology | 0.42 µm CMOS | — |
| Supply Voltage (Operating) | 3.0 V to 3.6 V | — |
| Nominal Core Voltage | 3.3 V | — |
| Configuration Memory | SRAM (volatile, requires external PROM) | — |
| Architecture | OptiFLEX | — |
| Gehäuse | 240-pin PQFP (BFQFP, 32x32 mm) | — |
| Montageart | Surface Mount | Surface Mount (Gull-Wing) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| RoHS-Status | unknown | [DATA_NEEDED: lead-free status] |
| Device Logic Elements | — | 1960 cells |
| Typical Gates | — | 24,000 |
| Maximum Gates | — | 28,000 |
| Total RAM Bits | — | 4,992 |
| Technology | — | 0.42 µm CMOS (4-layer metal) |
| Versorgungsspannung | — | 3.3 V |
| Package Type | — | 240-pin PQFP / BFQFP |
| Speed Grade | — | -2 |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial configuration |