EPF8282ATC100-4 vs EPF8282ATC100-2 Vergleich
Detaillierter Direktvergleich von EPF8282ATC100-4 von Intel und EPF8282ATC100-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF8282ATC100-4 | EPF8282ATC100-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,95 | $9,75 |
| Series | FLEX 8000 | — |
| Family | Flex 8000 FPGA | FLEX 8000 |
| Number of Logic Elements/Cells | 208 | — |
| Number of LABs/CLBs | 26 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 78 | — |
| Usable Gates | 2500 | 2,500 |
| Versorgungsspannung | 5 V | 5 V |
| I/O Voltage (MultiVolt) | 3.3 V or 5.0 V | — |
| Betriebstemperatur | 0 C to 70 C | 0 °C to 70 °C (Commercial) |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 100-TQFP (LFQFP, S-PQFP-G100) | — |
| Pin-Anzahl | 100 | — |
| Terminal Pitch | 0.500 mm | — |
| Logic Family | CMOS | — |
| Configuration Method | SRAM (serial or parallel EPROM) | — |
| Configuration Devices Supported | EPC1, EPC1064, EPC1213, EPC1441 | — |
| RoHS-Status | [DATA_NEEDED: RoHS status - obsolete part] | [DATA_NEEDED: RoHS status] |
| Temperature Grade | Commercial | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Logic Cells | — | 208 |
| Logic Array Blocks (LABs) | — | 26 |
| User I/Os | — | 78 |
| Flip-Flops | — | 282 |
| Process Technology | — | 0.42 µm CMOS |
| Gehäuse | — | 100-pin TQFP |
| Speed Grade | — | -2 |
| Configuration Memory | — | SRAM (volatile, requires external boot) |
| Development Tool | — | Altera MAX+PLUS II |