EPM2210F256C4N vs EPM2210F256A5NGA Vergleich
Detaillierter Direktvergleich von EPM2210F256C4N von Intel und EPM2210F256A5NGA von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210F256C4N | EPM2210F256A5NGA |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $39,85 | $48,75 |
| Family | MAX II | MAX II |
| Device Type | CPLD | — |
| Logic Elements (LE) | 2210 | — |
| Macro Cells | 1700 | — |
| User Flash Memory | 204 Kbit | 8 Kbits (typical for MAX II family) |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Propagation Delay (tPD) | 7.0 ns | — |
| Maximum User I/O Pins | 212 (varies with package) | — |
| Global Clock Networks | 4 | — |
| Process Technology | 0.18 µm | — |
| Core Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) | — |
| MultiVolt I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz | — |
| Betriebstemperaturbereich | 0 °C to +85 °C (Commercial) | 0C to +85C (NGA, commercial) |
| Gehäuse | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (NGA) |
| Programming Interface | JTAG IEEE Std. 1149.1 + ISP | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: rohs status from manufacturer] |
| Lead-Free | Yes | — |
| Logic Elements | — | 2210 |
| Macrocells | — | 1700 |
| Maximum Propagation Delay (tPD) | — | 7 ns (A5 speed grade) |
| User I/O Pins | — | 212 |
| Core Voltage | — | 1.8 V |
| Programmable Logic Blocks | — | 16 Logic Array Blocks |
| Configuration Method | — | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS (per bank) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free / halogen-free status] |