EPM570GF256C5N vs EPM570M256C4N Vergleich
Detaillierter Direktvergleich von EPM570GF256C5N von Intel und EPM570M256C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570GF256C5N | EPM570M256C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,95 | $8,31 |
| Device Family | MAX II | — |
| Logic Elements | 570 | — |
| Macrocells | 440 | — |
| Maximum User I/Os | 212 | 160 |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Maximum Frequency (fMAX) | 304 MHz | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Operating Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage Support (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Gehäuse | 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch) | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm |
| Process Technology | 0.18 µm Flash-based CMOS | 0.18 µm CMOS |
| Configuration Method | Non-volatile, instant-on (Flash) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1) / ISP |
| Betriebstemperatur | -40 °C to +125 °C (Industrial) | -40 °C to +125 °C |
| Lead-Free / RoHS | Yes (Lead-free finish) | Yes, LEAD FREE (per datasheet.com spec listing) |
| Family | — | MAX II |
| Device Logic Elements | — | 440 LE |
| Macro Cells | — | 440 |
| Internal Performance (fMAX) | — | 247.5 MHz |
| Core Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Configuration Memory | — | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) |
| Montageart | — | Surface Mount (BGA) |
| Logic Family | — | CMOS |