EPM570GM256C5N vs EPM570GM256I5N Vergleich
Detaillierter Direktvergleich von EPM570GM256C5N von Intel und EPM570GM256I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570GM256C5N | EPM570GM256I5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,60 | $21,40 |
| Series | MAX II | MAX II G |
| Family | CPLD - Complex Programmable Logic Device | — |
| Macro Cells | 440 | — |
| Logic Array Blocks (LABs) | 57 | — |
| Number of I/Os | 160 | — |
| Maximum Operating Frequency | 304 MHz | — |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz | — |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns | — |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) | — |
| Process Technology | 0.18 um flash-based CMOS | 6-layer-metal flash CMOS |
| Programmable Type | In System Programmable (ISP) via JTAG | In-System Programmable (ISP) |
| Gehäuse / Bauform | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | -40 C to +100 C (TJ, industrial) |
| Montagestil | SMD/SMT | — |
| Packaging | Tray | — |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot | — |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| JTAG Support | Yes (IEEE 1149.1 / 1532) | — |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package | — |
| Device Family | — | MAX II |
| Logic Elements (LE) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| Propagation Delay (tpd) | — | 5.4 ns (max) |
| Internal Supply Voltage | — | 1.71 V to 1.89 V |
| User Flash Memory (UFM) | — | 8 Kbits |
| Package Type | — | 256-TFBGA (MBGA), 11x11 mm |
| Montageart | — | Surface Mount |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| JTAG / Boundary Scan | — | IEEE 1149.1 compliant |