EPM570GM256C5N vs EPM570M256C4N Vergleich
Detaillierter Direktvergleich von EPM570GM256C5N von Intel und EPM570M256C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570GM256C5N | EPM570M256C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,60 | $8,31 |
| Series | MAX II | — |
| Family | CPLD - Complex Programmable Logic Device | MAX II |
| Macro Cells | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | — |
| Number of I/Os | 160 | — |
| Maximum Operating Frequency | 304 MHz | — |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz | — |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns | — |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) | — |
| Process Technology | 0.18 um flash-based CMOS | 0.18 µm CMOS |
| Programmable Type | In System Programmable (ISP) via JTAG | — |
| Gehäuse / Bauform | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | -40 °C to +125 °C |
| Montagestil | SMD/SMT | — |
| Packaging | Tray | — |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot | — |
| Configuration Memory | Internal flash (non-volatile, instant-on) | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) |
| JTAG Support | Yes (IEEE 1149.1 / 1532) | — |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package | — |
| Device Logic Elements | — | 440 LE |
| Maximum User I/Os | — | 160 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Internal Performance (fMAX) | — | 247.5 MHz |
| Core Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |
| Gehäuse | — | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm |
| Montageart | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes, LEAD FREE (per datasheet.com spec listing) |
| Logic Family | — | CMOS |