EPM570GT144C3 vs EPM570GT144C4N Vergleich
Detaillierter Direktvergleich von EPM570GT144C3 von Intel und EPM570GT144C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570GT144C3 | EPM570GT144C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,50 | $22,50 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/O Count | 76 (max, package-dependent) | — |
| Pin-to-Pin Propagation Delay (tPD1) | 5.4 ns (commercial, fastest speed grade) | — |
| User Flash Memory (UFM) | 8 Kbits (8,192 bits) | 8 Kbit |
| Core Supply Voltage | 1.8 V (internal regulator from VCCINT 3.3 V) | — |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial, C3 grade) | 0 °C to +85 °C (commercial) |
| Gehäuse | 144-pin TQFP (GT144) | 144-pin TQFP |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 0.30 µm 6-layer-metal flash CMOS | 0.18 µm, 6-layer-metal flash |
| Configuration Method | Non-volatile on-chip flash (instant-on) | — |
| Programming Interface | JTAG IEEE 1149.1 (ISP) | JTAG (IEEE 1149.1) / ByteBlaster |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | MSL 3 (per JEDEC J-STD-020) | — |
| Logic Elements (LE) | — | 570 |
| Macrocells | — | 440 |
| Maximum User I/O | — | 116 |
| Pin-to-Pin Logic Delay (tPD) | — | 5.4 ns (C4 speed grade) |
| Supply Voltage (VCCINT) | — | 3.3 V |
| MultiVolt I/O Support | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Configuration Memory | — | Non-volatile internal flash |