K4AAG085WA-BCPB vs K4AAG085WM-BCRC Vergleich
Detaillierter Direktvergleich von K4AAG085WA-BCPB von Samsung Electronics und K4AAG085WM-BCRC von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | K4AAG085WA-BCPB | K4AAG085WM-BCRC |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,92 | $1,00 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | [DATA_NEEDED: exact density in Gb] |
| Speicherorganisation | 2G x 8 | x8 |
| Versorgungsspannung | 1.2 V | — |
| Speed Grade | [DATA_NEEDED: speed grade Mbps for BCPB suffix] | — |
| Gehäuse | 78FBGA | 78-ball FBGA |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 C to 85 C (commercial grade, per K4AAG085WA family data) | [DATA_NEEDED: operating temperature range] |
| Schnittstelle | Parallel (DDR4) | SSTL12 |
| Clock Type | Synchronous, differential clock | — |
| Bank Architecture | DDR4 bank group architecture | — |
| DLL Mode | DLL Enabled mode operation (per Samsung datasheet abstract) | — |
| Memory Format | DRAM | — |
| RoHS-Status | Compliant (per family listing on JLCPCB) | [DATA_NEEDED: RoHS status] |
| Temperature Grade Code | C (per Samsung part number coding) | — |
| Speed Bin Code | PB (per Samsung part number coding) | — |
| Supply Voltage (VDD) | — | 1.2 V |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Max Data Rate | — | Up to 3200 Mbps/pin (family max per Samsung DDR4 page) |
| Architecture | — | Bank-group DDR4 |
| Termination | — | On-Die Termination (ODT) |
| CAS-Latenz | — | [DATA_NEEDED: CL of -BCRC speed grade] |
| Clock | — | Differential clock CK/CK# |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |