LFE2-6E-6FN256I vs LFE2-6E-6F256I Vergleich

Detaillierter Direktvergleich von LFE2-6E-6FN256I von Lattice Semiconductor und LFE2-6E-6F256I von Lattice Semiconductor. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Lattice Semiconductor
LFE2-6E-6FN256I LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-6FN256I ✓ Aktiv
Lattice Semiconductor
LFE2-6E-6F256I LFE2-6E-6F256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-6F256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice

LFE2-6E-6F256I ✓ Aktiv

Spezifikationsvergleich

Parameter LFE2-6E-6FN256I LFE2-6E-6F256I
Marke Lattice Semiconductor Lattice Semiconductor
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type ECP2 Field Programmable Gate Array (FPGA) ECP2 Field Programmable Gate Array (FPGA)
Logic Cells 6,000 cells —
Logic Blocks 750 LABs —
Embedded RAM 56,320 bits (67 KB) —
User I/O 190 I/O —
Maximum Frequency 357 MHz —
Core Supply Voltage 1.14 V to 1.26 V —
Nominal Core Voltage 1.2 V —
Process Technology 90 nm —
Betriebstemperatur -40°C to +100°C [DATA_NEEDED: operating temperature range]
Temperature Grade Industrial —
Gehäuse 256-ball FBGA, 17 mm × 17 mm 256-BGA
Package Code FPBGA-256 —
Montageart Surface Mount Surface Mount
Terminal Type Ball —
Number of Terminals 256 balls —
Package Shape Square —
Lead-Free Status Lead free —
Standard Packaging Tray —
Standard Quantity 90 units —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH compliance status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] [DATA_NEEDED: automotive qualification status]
Logic Elements — 6,000
Equivalent Logic Blocks — 750
Total RAM — 56,320 bits
General-Purpose User I/Os — 190
Speed Grade — -6
Supply Designation — 1.2 V
Temperature Designation — Industrial
Package Type — Fine-Pitch Ball Grid Array
Package Dimensions — 17 mm x 17 mm
Logic Resource Class — 6K LUT FPGA
DSP Feature — Advanced DSP blocks listed for the ECP2/M family
Configuration — Field programmable
Manufacturer — Lattice Semiconductor Corporation
Product Family — ECP2
Pinout — [DATA_NEEDED: complete 256-BGA pinout]

Datenblätter & Ressourcen

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