M1AFS1500-1FGG256I vs M1AFS1500-1FGG256K Vergleich

Detaillierter Direktvergleich von M1AFS1500-1FGG256I von Microchip Technology und M1AFS1500-1FGG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS1500-1FGG256I M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I ✓ Aktiv
Microchip Technology
M1AFS1500-1FGG256K M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256K ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS1500-1FGG256I M1AFS1500-1FGG256K
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $136,90 $0,00
Family Fusion (M1 series, mixed-signal FPGA) Fusion Mixed-Signal FPGA
System Gates 1.5 million —
Processor Core ARM Cortex-M1 (soft core in fabric) —
User I/O 119 —
Flash Configuration Memory 276480 bits —
Logic Cells 38400 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm flash-based —
Gehäuse 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch —
Betriebstemperatur -40C to +85C (industrial, I suffix) -55C to +100C (TJ)
Speed Grade -1 (standard) —
Configuration Type Flash-based, instant-on, single chip —
Security 128-bit flash lock, AES decryption —
Analog Features Configurable analog blocks (mixed-signal) —
Clock Management Integrated CCC (clock conditioning circuits) —
Montageart Surface Mount Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status] RoHS3 Compliant
Number of Gates — 1,500,000 system gates
Number of I/O — 119
Total RAM Bits — 276480
Embedded Processor — ARM Cortex-M1
Versorgungsspannung — 1.425 V to 1.575 V (1.5 V nominal)
Max Frequency — 1282.05 MHz
Technology — 130 nm flash-based
Gehäuse / Bauform — 256-LBGA (256-FBGA, 17x17 mm)
Supplier Device Package — 256-FPBGA (17x17)
Packaging — Tray
Programmable Type — In-System Programmable (flash-based, non-volatile)
Lead Free Status — Lead Free
Manufacturer Lead Time — 16 weeks
Product Status — Active

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