M1AFS1500-FG676I vs M1AFS1500-2FG676I Vergleich

Detaillierter Direktvergleich von M1AFS1500-FG676I von Microchip Technology und M1AFS1500-2FG676I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS1500-FG676I M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip

M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip

M1AFS1500-FG676I ✓ Aktiv
Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS1500-FG676I M1AFS1500-2FG676I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $425,73 $405,00
Family Fusion (M1AFS1500) Fusion (Mixed-Signal Flash FPGA)
System Gates 1.5 M 1.5 M
Technology 130 nm flash-based —
Core Supply Voltage 1.5 V 1.5 V
User I/O 252 —
Gehäuse 676-ball FBGA (FG676) 676-ball FBGA (FG676)
Montageart Surface Mount Surface Mount
Configuration Type Flash-based, non-volatile (no external config PROM) —
Analog Blocks Configurable analog subsystem (ADC, voltage/temp monitors) —
Clock Management Integrated CCC (clock conditioning circuits) with PLL —
On-chip Flash Memory Large flash memory blocks integrated —
Performance Figure 1098.9 MHz (family-rated internal clock figure) —
Temperature Grade Industrial (-40C to +85C), suffix I —
Packaging Tray —
RoHS-Status [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead)
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Process Technology — 130 nm CMOS
Speed Grade — 2
Configuration Memory — On-chip flash (non-volatile, instant-on)
Betriebstemperaturbereich — Industrial (I suffix) -40C to +100C
Embedded Analog Features — On-chip ADC, clock conditioning circuit (CCC), power-on reset
External Configuration Device — Not required
Lead Free Status — Contains Lead
Packaging Method — Tray
Number of User I/O — [DATA_NEEDED: Number of User I/O]
Embedded SRAM — [DATA_NEEDED: Embedded SRAM capacity]
DLL/PLL Blocks — [DATA_NEEDED: Number of CCC blocks]

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