M1AFS250-1FGG256I vs M1AFS250-2FG256I Vergleich
Detaillierter Direktvergleich von M1AFS250-1FGG256I von Microchip Technology und M1AFS250-2FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ AktivMicrochip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS250-1FGG256I | M1AFS250-2FG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Series | M1AFS250 (Fusion) | — |
| System Gates | 250,000 gates | 250K |
| Logic Cells | 6144 | — |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 | — |
| Number of I/O | 114 | — |
| Maximum System Frequency | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) | ARM Cortex-M1 (hard IP) |
| Technology | 130-nm, 7-layer metal, flash-based CMOS | — |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) | Flash-based, nonvolatile |
| Security | 128-bit flash-based lock, AES decryption | — |
| Betriebsversorgungsspannung | 1.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Gehäuse / Bauform | 256-LBGA (FBGA), 1.00 mm ball pitch | — |
| Montagestil | SMD/SMT | — |
| Packaging | Tray | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | Fusion (M1AFS, ARM Cortex-M1 support) |
| User I/O | — | 114 |
| Embedded RAM Bits | — | 36864 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | — | 350 MHz |
| Power-Up Mode | — | Live at Power-Up (LAPU) |
| Analog Block | — | Configurable analog (voltage, current, temperature monitoring) |
| Gehäuse | — | 256-ball FBGA (256-LBGA) |
| Speed Grade | — | -2 |
| Temperature Range | — | Industrial (-40C to +85C) |
| Montageart | — | Surface Mount |