M1AFS600-1FG256 vs M7AFS600-FG256I Vergleich

Detaillierter Direktvergleich von M1AFS600-1FG256 von Microchip Technology und M7AFS600-FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS600-1FG256 M1AFS600-1FG256 - Fusion FPGA, 600K Gates | Microchip

M1AFS600-1FG256 - Fusion FPGA, 600K Gates | Microchip

M1AFS600-1FG256 ✓ Aktiv
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS600-1FG256 M7AFS600-FG256I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $69,15 $0,00
Series Fusion M7AFS600 (Fusion)
Number of Logic Elements/Cells [DATA_NEEDED: Number of Logic Elements/Cells] —
Total RAM Bits 110592 —
Number of I/O 119 119 I/O
Number of Gates 600000 —
Voltage - Supply 1.425V ~ 1.575V —
Montageart Surface Mount —
Gehäuse / Bauform 256-LBGA 256-LBGA (FBGA)
Supplier Device Package 256-FPBGA (17x17) —
Betriebstemperatur 0°C ~ 85°C (TJ) —
RoHS-Status RoHS non-compliant —
Manufacturer Lead Time 16 weeks —
Product Status Active —
Packaging Tray Tray
Core Voltage 1.5V —
Technology 130nm —
Maximum Frequency 1282.05MHz —
System Gates — 600K
Logic Capacity (DigiKey listing) — 110592
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
Process Technology — 130 nm
Terminal Form — Ball
Package Shape — Square
Montagestil — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

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