M1AFS600-2FGG256 vs M1AFS1500-1FGG256K Vergleich
Detaillierter Direktvergleich von M1AFS600-2FGG256 von Microchip Technology und M1AFS1500-1FGG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS600-2FGG256 - Fusion 600K-Gate Mixed-Signal FPGA | Microchip
M1AFS600-2FGG256 ✓ AktivMicrochip Technology
M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256K ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS600-2FGG256 | M1AFS1500-1FGG256K |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Family | Fusion (M1) Mixed-Signal FPGA | Fusion Mixed-Signal FPGA |
| System Gates | 600K | — |
| User I/O | 119 | — |
| Programmable Resources (DigiKey listing) | 110592 | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | — |
| Maximum Frequency | 1470.59 MHz | — |
| Configuration Technology | Flash-based (non-volatile) | — |
| Gehäuse | 256-LBGA (FBGA / FG256) | — |
| Montageart | Surface Mount | Surface Mount |
| Analog Peripherals | Integrated configurable analog subsystem | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | -55C to +100C (TJ) |
| I/O Supply Voltage | [DATA_NEEDED: I/O Supply Voltage] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Number of Gates | — | 1,500,000 system gates |
| Number of I/O | — | 119 |
| Total RAM Bits | — | 276480 |
| Embedded Processor | — | ARM Cortex-M1 |
| Versorgungsspannung | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Max Frequency | — | 1282.05 MHz |
| Technology | — | 130 nm flash-based |
| Gehäuse / Bauform | — | 256-LBGA (256-FBGA, 17x17 mm) |
| Supplier Device Package | — | 256-FPBGA (17x17) |
| Packaging | — | Tray |
| Programmable Type | — | In-System Programmable (flash-based, non-volatile) |
| RoHS-Status | — | RoHS3 Compliant |
| Lead Free Status | — | Lead Free |
| Manufacturer Lead Time | — | 16 weeks |
| Product Status | — | Active |