M1AFS600-FG484K vs M1AFS600-FG484I Vergleich

Detaillierter Direktvergleich von M1AFS600-FG484K von Microchip Technology und M1AFS600-FG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS600-FG484K M1AFS600-FG484K - 600K-Gate Fusion FPGA, 172 I/O | Microchip

M1AFS600-FG484K - 600K-Gate Fusion FPGA, 172 I/O | Microchip

M1AFS600-FG484K ✓ Aktiv
Microchip Technology
M1AFS600-FG484I M1AFS600-FG484I - 600K Gates Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS600-FG484I - 600K Gates Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS600-FG484I ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS600-FG484K M1AFS600-FG484I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $108,50 $0,00
Family Fusion (Mixed-Signal Flash FPGA) —
System Gates 600000 gates —
User I/Os 172 —
Logic Elements / Registers 110592 —
Processor Core ARM Cortex-M1 (hard core) —
Technology Flash-based (non-volatile configuration) —
Gehäuse 484-BGA (484-FBGA) —
Montageart Surface Mount —
Supplier Device Package 484-BGA —
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
Core Voltage [DATA_NEEDED: core voltage] —
I/O Voltage [DATA_NEEDED: I/O voltage support] —
Embedded Memory [DATA_NEEDED: embedded SRAM/flash block capacity] —
Speed Grade [DATA_NEEDED: speed grade] —
Programming Type In-system programmable via on-chip Flash —
RoHS-Status [DATA_NEEDED: RoHS status] Non-Compliant (contains lead, FG variant)
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Series — Fusion (M1AFS600)
Number of System Gates — 600000 gates
Logic Cells — 13824
Number of I/Os — 172
Memory Bits (DigiKey listing) — 110592 bits
Embedded Processor — ARM Cortex-M1
Core Supply Voltage — 1.5 V
Process Technology — 130 nm (CMOS flash-based)
Frequency (per FindIC listing) — 1098.9 MHz
Gehäuse / Bauform — FBGA-484 (484-BGA), 1.0 mm pitch
Montagestil — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Security — 128-bit flash lock, AES decryption
Configuration — Flash-based, live at power-up
Packaging — Tray
Lead Free Status — Contains Lead
Total RAM Blocks — [DATA_NEEDED: total embedded RAM blocks]
Analog Blocks — [DATA_NEEDED: number of analog conditioning blocks]

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