M2GL090-FGG676 vs M2GL090-1FG676 Vergleich
Detaillierter Direktvergleich von M2GL090-FGG676 von Microchip Technology und M2GL090-1FG676 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M2GL090-FGG676 - 86K LEs, 1.2V, 676-FBGA FPGA | Microchip
M2GL090-FGG676 ✓ AktivMicrochip Technology
M2GL090-1FG676 - 86K IGLOO2 FPGA with 425 I/O | Microchip
M2GL090-1FG676 ✓ AktivSpezifikationsvergleich
| Parameter | M2GL090-FGG676 | M2GL090-1FG676 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | IGLOO2 low-density FPGA | IGLOO2 low-density FPGA |
| Logic Elements | 86,316 cells | 86,184 LE |
| User I/O | 425 I/O | — |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 676-pin FBGA | 676-ball FBGA |
| Package Type | Surface Mount | — |
| Pin-Anzahl | 676 pins | — |
| Programmable Logic Type | FPGA (Field Programmable Gate Array) | — |
| Configuration Memory Type | Flash | — |
| Manufacturer Product Status | In Production | — |
| Manufacturer | Microchip Technology | Microchip Technology |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | [DATA_NEEDED: supported I/O standards] |
| Embedded Memory Capacity | [DATA_NEEDED: embedded memory capacity] | — |
| Unit Price | [DATA_NEEDED: current distributor unit price] | — |
| Series | — | M2GL090 |
| Programmable Cells | — | 86,316 cells |
| Number of I/O | — | 425 I/O |
| Betriebsversorgungsspannung | — | 1.2 V |
| Minimum Operating Temperature | — | 0 °C |
| Maximum Operating Temperature | — | +85 °C |
| Package Designation | — | FPBGA-676 |
| Montagestil | — | SMD/SMT |
| Packaging | — | Tray |
| Product Category | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| Configuration Flash | — | [DATA_NEEDED: configuration flash capacity] |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Ball Pitch | — | [DATA_NEEDED: FBGA ball pitch] |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |