M7AFS600-1FG484I vs M7AFS600-2FG484 Vergleich

Detaillierter Direktvergleich von M7AFS600-1FG484I von Microchip Technology und M7AFS600-2FG484 von Microsemi. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M7AFS600-1FG484I M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I ✓ Aktiv

Spezifikationsvergleich

Parameter M7AFS600-1FG484I M7AFS600-2FG484
Marke Microchip Technology Microsemi
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $198,00 $276,95
System Gates 600000 600K
Programmable Logic Tiles 110592 —
User I/O 172 172
Family Fusion (Flash FPGA with optional ARM CoreMP7 support) Fusion (Mixed-Signal FPGA)
Process Technology 130 nm, 7-layer metal, Flash-based CMOS 130 nm flash-based
Configuration Memory Nonvolatile Flash, retains program when powered off On-chip flash, instant-on
Power-Up Feature Live at Power-Up (LAPU) —
Supply Voltage (Core) 1.5 V —
Logic Family CMOS —
Speed Grade 1 -2
Gehäuse 484-ball FBGA (FG484), 23 x 23 x 2.44 mm 484-ball FBGA (FG484)
Ball Pitch 1.0 mm —
Betriebstemperatur Industrial, -40C to +85C —
Montageart Surface Mount Surface Mount
Embedded Processor Support ARM CoreMP7 —
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
Core Cells — 110592
Core Voltage — 1.5 V
Embedded Processor — ARM CoreMP7
Operating Temperature (commercial) — 0C to +70C (standard grade per -2FG suffix)
Mixed-Signal Peripherals — On-chip voltage/temperature monitoring (ADC)
Security — Flash lock, AES bitstream protection
Packaging — Tray
MSL-Level — [DATA_NEEDED: moisture sensitivity level]

Datenblätter & Ressourcen

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