M7AFS600-2FG484I vs M7AFS600-1FG484I Vergleich

Detaillierter Direktvergleich von M7AFS600-2FG484I von Microchip Technology und M7AFS600-1FG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M7AFS600-2FG484I M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip

M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip

M7AFS600-2FG484I ✓ Aktiv
Microchip Technology
M7AFS600-1FG484I M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I ✓ Aktiv

Spezifikationsvergleich

Parameter M7AFS600-2FG484I M7AFS600-1FG484I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $272,01 $198,00
Family Fusion (Flash-Based FPGA) Fusion (Flash FPGA with optional ARM CoreMP7 support)
System Gates 600000 gates 600000
Logic Elements (D Flip-Flops) 110592 —
User I/O 172 172
Core Supply Voltage 1.5 V —
Process Technology 130 nm, 7-layer metal flash-based CMOS 130 nm, 7-layer metal, Flash-based CMOS
Configuration Memory Nonvolatile on-chip flash (retains program when powered off) Nonvolatile Flash, retains program when powered off
Live at Power-Up (LAPU) Yes —
Optional Processor Support ARM CoreMP7 —
Speed Grade -2 1
Betriebstemperatur 0 to 70 C Industrial, -40C to +85C
Temperature Grade Industrial (I suffix) —
Gehäuse 484-ball FBGA, 1.0 mm pitch 484-ball FBGA (FG484), 23 x 23 x 2.44 mm
Montageart Surface Mount Surface Mount
Logic Family CMOS CMOS
Packaging Tray —
Programmable Logic Tiles — 110592
Power-Up Feature — Live at Power-Up (LAPU)
Supply Voltage (Core) — 1.5 V
Ball Pitch — 1.0 mm
Embedded Processor Support — ARM CoreMP7
RoHS-Status — Compliant

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