M7AFS600-2FGG256I vs M7AFS600-1FGG256I Vergleich
Detaillierter Direktvergleich von M7AFS600-2FGG256I von Microchip Technology und M7AFS600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ AktivMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | M7AFS600-2FGG256I | M7AFS600-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $389,60 | $0,00 |
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600000 | 600K |
| User I/O | 119 | — |
| Flash Memory Blocks | 110592 bits | — |
| Processor Support | ARM CoreMP7 | — |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | 350 MHz | Up to 350 MHz |
| Versorgungsspannung | 1.5 V (core) | — |
| Logic Family | CMOS | — |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) | — |
| Gehäuse | 256-LBGA (FBGA-256), 1.0 mm ball pitch | — |
| Number of Pins/Balls | 256 | — |
| Betriebstemperatur | 0 to 70 C | — |
| Speed Grade | -2 | -1 |
| Montageart | Surface Mount | — |
| Packaging | Tray | Tray |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Betriebsversorgungsspannung | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile) |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Gehäuse / Bauform | — | 256-Ball FBGA (FGG256) |
| Montagestil | — | SMD/SMT |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |