M7AFS600-FGG484I vs M7AFS600-1FGG484I Vergleich

Detaillierter Direktvergleich von M7AFS600-FGG484I von Microchip Technology und M7AFS600-1FGG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M7AFS600-FGG484I M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip

M7AFS600-FGG484I ✓ Aktiv
Microchip Technology
M7AFS600-1FGG484I M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M7AFS600-1FGG484I ✓ Aktiv

Spezifikationsvergleich

Parameter M7AFS600-FGG484I M7AFS600-1FGG484I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $219,20 $228,00
Programmable Logic Family Fusion (Microsemi/Actel, now Microchip) —
System Gates 600000 gates 600000
Embedded Processor ARM CoreMP7 (ARM7TDMI-compatible) ARM CoreMP7
User I/O 172 I/O —
Configuration Technology Flash-based, on-chip —
Core Supply Voltage 1.5 V —
Gehäuse 484-BGA (FGG484), 1.0 mm ball pitch —
Montageart Surface Mount —
Betriebstemperatur -40C to +100C (industrial, I grade) -40C to +85C
Memory - Listable Resource 110592 (per DigiKey listing) —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] 1282.05 MHz
I/O Bank Count [DATA_NEEDED: I/O bank count] —
Embedded Flash Blocks [DATA_NEEDED: embedded flash block count] —
Analog Peripherals [DATA_NEEDED: analog peripheral configuration] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
RoHS-Status [DATA_NEEDED: RoHS status] ROHS3 Compliant
Programming Tool Chain Microchip Libero SoC (formerly Actel Libero) —
Series — Fusion (M7AFS600)
Number of I/Os — 172
Total RAM Bits — 110592
Versorgungsspannung — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Process Technology — 130 nm
Speed Grade — 1 (M7, fastest family grade)
Gehäuse / Bauform — 484-BGA (FBGA)
Supplier Device Package — 484-FPBGA (23x23)
Montagestil — SMD/SMT
Packaging — Tray
Programmable Type — Flash-based, In-System Programmable
Manufacturer Lead Time — 16 weeks
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Number of Logic Cells — [DATA_NEEDED: logic cell count]

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