MAX157BCPA vs TS7003ITD833 Vergleich
Detaillierter Direktvergleich von MAX157BCPA von Maxim Integrated und TS7003ITD833 von Silicon Labs. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Silicon Labs
TS7003ITD833 - 12-Bit 300ksps SAR ADC, 2.5V Ref, TDFN-8 | Silicon Labs
TS7003ITD833 ✓ AktivSpezifikationsvergleich
| Parameter | MAX157BCPA | TS7003ITD833 |
|---|---|---|
| Marke | Maxim Integrated | Silicon Labs |
| Kategorie | ADC/DAC | ADC/DAC |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,10 | $1,49 |
| Auflösung | 10 bit | 12 bit |
| Number of Channels | 2 | 1 input |
| Abtastrate | 108 ksps | 300 ksps |
| Conversion Time | 7.4 µs | — |
| Versorgungsspannung | +2.7 V to +5.25 V | — |
| Supply Current (active at 3.6V) | 3.2 mW (typ) | — |
| Wake-Up Time | 2.5 µs | — |
| INL (max) | ±1 LSB | — |
| Architecture | SAR (Successive Approximation) | SAR (successive approximation) |
| Schnittstelle | 3-wire SPI/QSPI/MICROWIRE-compatible serial | — |
| Shutdown Mode | Yes - auto power-down + SHDN pin | — |
| On-Chip Clock | Yes (internal oscillator) | — |
| Gehäuse | 8-pin PDIP | TDFN-EP8 (3 x 3 mm) with exposed pad |
| Montageart | Through-Hole | Surface Mount |
| Betriebstemperatur | 0°C to +70°C (commercial) | — |
| RoHS-Status | Compliant (Pb-free '+' suffix versions) | Compliant (per distributor listing) |
| Supply Voltage (Analog/Digital) | — | 2.7 V to 3.6 V |
| Supply Current at 300 ksps | — | < 1 mA |
| Input Type | — | Single-ended (single channel) |
| Internal Reference | — | +2.5 V |
| Digital Interface | — | High-speed serial (SPI-compatible) |
| Data Output Format | — | Serial (12-bit) |
| Betriebstemperaturbereich | — | Industrial (-40C to +85C) |
| Track-and-Hold Bandwidth | — | High bandwidth (per datasheet) |
| Conversion-Mode Power | — | Low (per datasheet) |