MC56F8346VFVE vs MC56F8155VFGE Vergleich
Detaillierter Direktvergleich von MC56F8346VFVE von NXP Semiconductors und MC56F8155VFGE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC56F8346VFVE - 16-Bit 60MHz 128KB Flash DSC | NXP LQFP-144
MC56F8346VFVE ✓ AktivNXP Semiconductors
MC56F8155VFGE - 16-bit DSC, 256KB Flash, 40MHz, LQFP-128 | NXP
MC56F8155VFGE ObsoleteSpezifikationsvergleich
| Parameter | MC56F8346VFVE | MC56F8155VFGE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,10 | $10,20 |
| Core | 56800E (16-bit hybrid DSC core) | — |
| Core Architecture | Harvard, dual-issue DSP + MCU | — |
| Maximum Core Frequency | 60 MHz | — |
| Program Memory (Flash) | 128 KB (64K x 16) | — |
| Data Memory (RAM) | [DATA_NEEDED: RAM size] | — |
| Datenbusbreite | 16 bit | — |
| Supply Voltage (VDD) | 3.0 V to 3.6 V | — |
| Betriebstemperatur | -40 C to +105 C (industrial) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 144-LQFP (20 x 20 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| ADC | [DATA_NEEDED: ADC resolution and count] | — |
| PWM Modules | [DATA_NEEDED: FlexPWM channel count] | — |
| Communication Interfaces | SCI, SPI, CAN, I2C | — |
| GPIO Count | [DATA_NEEDED: GPIO count for LQFP-144] | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance] |
| Core Processor | — | 56800E |
| Core Size | — | 16-Bit |
| Core Speed | — | 40 MHz |
| Program Memory Size | — | 256 KB (128K x 16) Flash |
| RAM Size | — | 8 KB (4K x 16) |
| Number of I/O | — | 49 |
| Connectivity | — | EBI/EMI, SCI, SPI |
| Peripherals | — | POR, PWM, WDT |
| Gehäuse / Bauform | — | 128-LQFP (14x20 mm) |
| Oscillator Type | — | External |
| Packaging | — | Tray |
| Architecture | — | Harvard (unified address space) |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| Data Converter | — | [DATA_NEEDED: ADC resolution and channels] |