MC56F8356MFV60 vs MC56F8356MFVE Vergleich
Detaillierter Direktvergleich von MC56F8356MFV60 von NXP Semiconductors und MC56F8356MFVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC56F8356MFV60 | MC56F8356MFVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,75 | $0,00 |
| Core Architecture | 56800E (16-bit DSC, dual Harvard) | — |
| Core Frequency | 60 MHz | — |
| Program Flash | 256 KB | — |
| Unified RAM | 4 KB | — |
| Data Flash | 8 KB | — |
| Versorgungsspannung | 3.0 V to 3.6 V | 2.5V / 3.3V |
| Betriebstemperatur | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 144-pin LQFP (LFQFP) | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount | Surface Mount |
| ADC | 2 x 12-bit, up to 8 channels | — |
| FlexPWM | Yes (dual 6-output modules with fault inputs) | — |
| FlexCAN | Yes (1 module) | — |
| SCI/UART | 2 ports | — |
| SPI | 1 port | — |
| External Memory Interface | Yes | — |
| MSL-Level | 3 (168 Hours) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| HTSUS | 8542.31.0001 | — |
| Debug Interface | JTAG/Enhanced OnCE | — |
| Core Processor | — | 56800E |
| Core Size | — | 16-bit |
| Maximale Taktfrequenz | — | 60 MHz |
| Program Memory Size | — | 256KB (128K x 16) Flash |
| Architecture | — | CISC (56800E core-based DSC) |
| Product Family | — | 56F8xxx (56800E core DSC family) |
| Pin-Anzahl | — | 144 |
| Packaging | — | Tray |
| Product Status | — | End of Life (EOL) |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |