MC68HC908GP32CB vs MC908GP32CBE Vergleich

Detaillierter Direktvergleich von MC68HC908GP32CB von NXP Semiconductors und MC908GP32CBE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC68HC908GP32CB MC68HC908GP32CB - 8-Bit 8MHz MCU 32KB Flash 42-PDIP | NXP

MC68HC908GP32CB - 8-Bit 8MHz MCU 32KB Flash 42-PDIP | NXP

MC68HC908GP32CB ✓ Aktiv
NXP Semiconductors
MC908GP32CBE MC908GP32CBE - 8-Bit HC08 MCU, 32KB Flash, 8MHz | NXP

MC908GP32CBE - 8-Bit HC08 MCU, 32KB Flash, 8MHz | NXP

MC908GP32CBE Obsolete

Spezifikationsvergleich

Parameter MC68HC908GP32CB MC908GP32CBE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,48 $4,45
Core CPU08 (M68HC08) —
Family M68HC08 —
Sub-family GP32 (general purpose) —
Bus Frequency 8 MHz —
Program Memory 32 KB FLASH (32K x 8) —
RAM 512 bytes —
Data EEPROM / ROM [DATA_NEEDED: bytes] —
Versorgungsspannung 3.0 V to 5.5 V —
I/O Lines 33 —
ADC 10 channels x 8-bit —
Timers 2 x 16-bit (TIM1, TIM2) with capture/compare/PWM —
Serial Interfaces 1 x SPI, 1 x SCI —
Watchdog COP (programmable watchdog timer) —
Betriebstemperaturbereich -40C to +85C (industrial) [DATA_NEEDED: confirm exact grade] —
Gehäuse 42-pin PDIP (SDIP, 0.600 inch / 15.24 mm row spacing) —
Montageart Through-Hole (DIP) Through-Hole
RoHS-Status [DATA_NEEDED: confirm] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: confirm] [DATA_NEEDED: lead-free status]
Core Processor — HC08
Core Size — 8-Bit
Core Architecture — M68HC08 CISC
Program Memory Size — 32 KB (32K x 8)
Program Memory Type — FLASH
RAM Size — 512 B (512 x 8)
EEPROM Size — None
Maximale Taktfrequenz — 8 MHz
Supply Voltage Range — 3.0 V to 5.5 V
Number of I/O Pins — 31
Connectivity — SCI, SPI
Peripherals — LVD, POR, PWM, Timer
Gehäuse / Bauform — 42-SDIP (SPDIP, 0.600 in, 15.24 mm)
Packaging — Tube
Temperature Grade — Industrial
Debug Interface — Background Debug Mode (BDM)
Internal Oscillator — Yes

Datenblätter & Ressourcen

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