MC908QC8CDSE vs MC908QC16CDSE Vergleich

Detaillierter Direktvergleich von MC908QC8CDSE von NXP Semiconductors und MC908QC16CDSE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC908QC8CDSE MC908QC8CDSE - 8KB Flash 8-Bit HC08 MCU 20-TSSOP | NXP

MC908QC8CDSE - 8KB Flash 8-Bit HC08 MCU 20-TSSOP | NXP

MC908QC8CDSE Obsolete
NXP Semiconductors
MC908QC16CDSE MC908QC16CDSE - 8-bit HC08 MCU, 16KB Flash, 8MHz | NXP

MC908QC16CDSE - 8-bit HC08 MCU, 16KB Flash, 8MHz | NXP

MC908QC16CDSE ✓ Aktiv

Spezifikationsvergleich

Parameter MC908QC8CDSE MC908QC16CDSE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,65 $1,65
Core HC08 —
Processor Series HC08QC HC08QC
Datenbusbreite 8 bit 8 bit
Program Memory Size 8 KB (8K x 8) FLASH —
RAM Size 256 B [DATA_NEEDED: RAM size]
Maximale Taktfrequenz 8 MHz 8 MHz
Supply Voltage Range 2.7 V to 5.5 V —
Number of I/O Pins 13 (max, varies by package) —
Gehäuse 20-TSSOP (4.40 mm body width) 20-TSSOP (0.173 in, 4.40 mm width)
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich -40 C to +85 C (industrial) —
Instruction Set Architecture CISC (M68HC08) —
ADC [DATA_NEEDED: ADC resolution and channel count] —
Timers [DATA_NEEDED: timer count and channel detail] —
Communication Interfaces [DATA_NEEDED: SCI/SPI presence] —
Internal Oscillator [DATA_NEEDED: yes/no from datasheet] —
MSL-Level 3 (168 hours) —
RoHS-Status [DATA_NEEDED: per NXP product page] Pb-free (lead-free)
Core Processor — HC08
Core Size — 8-bit
Architecture — CISC, Von Neumann (M68HC08 Family)
Flash Memory — 16KB (16K x 8)
Versorgungsspannung — 3.3 V / 5 V
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Packaging — Rail
Pin-Anzahl — 20
Program Memory Type — FLASH
Manufacturer Family — HC08Q Family (M68HC08)
Application Segments — Automotive body electronics, appliances, security, motion control

Datenblätter & Ressourcen

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