MC9S08AW60CPUE vs MC9S08AW32CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AW60CPUE von NXP Semiconductors und MC9S08AW32CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60CPUE | MC9S08AW32CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $6,10 |
| Core Processor | S08 (HCS08) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Speed (CPU Clock) | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 60 KB (60K x 8) | 32KB (32K x 8) |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes | — |
| ADC | 10-bit | — |
| Instruction Set | HC08 (CISC) with added BGND instruction | HC08 with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Gehäuse | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | -40C to +85C |
| Life Cycle Stage | Active | — |
| Programmable Memory Type | Flash | — |
| Family | HCS08 (S08AW) | S08AW (AW60/48/32/16) |
| Max Clock Speed | — | 40 MHz |
| RAM | — | 2KB |
| ADC Resolution | — | 10-bit |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |