MC9S08AW60CPUE vs MC9S08AW50CFUE Vergleich
Detaillierter Direktvergleich von MC9S08AW60CPUE von NXP Semiconductors und MC9S08AW50CFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60CPUE | MC9S08AW50CFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Core Processor | S08 (HCS08) | HCS08 (S08) |
| Core Size | 8-Bit | 8-Bit |
| Speed (CPU Clock) | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | 50 KB (50K x 8) |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | [DATA_NEEDED: supply voltage range] |
| I/O Count | 38 | — |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes | LVD, POR |
| ADC | 10-bit | — |
| Instruction Set | HC08 (CISC) with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Gehäuse | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) | 64-QFP (14x14 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | Active | — |
| Programmable Memory Type | Flash | — |
| Family | HCS08 (S08AW) | — |
| Maximum Clock Speed | — | 40 MHz |
| Connectivity | — | I2C, SCI, SPI, UART/USART |
| Product Family | — | S08AW (AW60/48/32/16 general-purpose family) |
| Applications | — | Industrial and Automotive |
| RAM | — | [DATA_NEEDED: SRAM size] |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O | — | [DATA_NEEDED: GPIO count] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance] |