MC9S08AW60CPUE vs MC9S08GB32ACFUE Vergleich
Detaillierter Direktvergleich von MC9S08AW60CPUE von NXP Semiconductors und MC9S08GB32ACFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60CPUE | MC9S08GB32ACFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Core Processor | S08 (HCS08) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Speed (CPU Clock) | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | 32KB (32K x 8) |
| RAM Size | 4 KB | 4KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.08 V to 3.6 V |
| I/O Count | 38 | 56 |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes | — |
| ADC | 10-bit | — |
| Instruction Set | HC08 (CISC) with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Gehäuse | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | Active | — |
| Programmable Memory Type | Flash | — |
| Family | HCS08 (S08AW) | — |
| Architecture | — | CISC |
| Clock Speed | — | 40 MHz |
| Nominal Supply Voltage | — | 2.5 V / 3.3 V |
| Terminal Form | — | Gull Wing |
| Temperature Grade | — | Industrial |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |
| Program Memory Type | — | FLASH |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |