MC9S08AW60MFDE vs MC9S08AC60CFDE Vergleich
Detaillierter Direktvergleich von MC9S08AW60MFDE von NXP Semiconductors und MC9S08AC60CFDE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60MFDE | MC9S08AC60CFDE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,46 | $8,60 |
| Core Architecture | HCS08 (8-bit CISC, enhanced HC08) | — |
| CPU Speed | 40 MHz (20 MHz internal bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 2 KB | — |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| I/O Ports | 38 | — |
| Gehäuse | 48-pin QFN-EP (7x7 mm, MO-220VKKD-2, 0.5 mm pitch) | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +85C (industrial) | — |
| ROM Type | Flash (in-application programmable) | — |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| ADC | Up to 16-channel 10-bit | — |
| Timers | Multiple 16-bit timer/PWM channels | — |
| Communication | SCI (UART), SPI, I2C | — |
| RoHS-Status | Compliant | ROHS COMPLIANT (per distributor datasheet listing) |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| CPU Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Betriebsversorgungsspannung | — | 3.3 V / 5 V |
| Number of I/O | — | 38 |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | Up to 16-channel with automatic compare function |
| Communication Interfaces | — | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC |
| Peripherals | — | ADC, SCI, SPI, IIC |
| Family Compatibility | — | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) |
| Lebenszyklusstatus | — | NRND (per NXP product page) |
| Packaging | — | Tray |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |