MC9S08AW60MPUE557 vs MC9S08AW60CPUE Vergleich

Detaillierter Direktvergleich von MC9S08AW60MPUE557 von NXP Semiconductors und MC9S08AW60CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08AW60MPUE557 MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 ✓ Aktiv
NXP Semiconductors
MC9S08AW60CPUE MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP

MC9S08AW60CPUE ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S08AW60MPUE557 MC9S08AW60CPUE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $6,10 $0,00
Core Architecture HCS08 (enhanced S08) —
Datenbusbreite 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
Betriebsversorgungsspannung 2.7 V to 5.5 V —
I/O Pins 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa —
Gehäuse 64-LQFP (10x10 mm) 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height)
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature Range]
ADC [DATA_NEEDED: number of channels and resolution] 10-bit
PWM Channels [DATA_NEEDED: PWM channel count] —
Serial Interfaces SCI, SPI, I2C (per NXP family description) —
Debug Interface Single-wire Background Debug Mode (BDM) Single-wire background debug mode (BDM)
RoHS-Status [DATA_NEEDED: RoHS compliance status] —
Lead-Free [DATA_NEEDED: lead-free status] —
Core Processor — S08 (HCS08)
Core Size — 8-Bit
Speed (CPU Clock) — 40 MHz
Flash Memory — 60 KB (60K x 8)
RAM Size — 4 KB
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Peripherals — 16-bit timer, ADC, SCI, SPI, multiple power-saving modes
Instruction Set — HC08 (CISC) with added BGND instruction
Life Cycle Stage — Active
Programmable Memory Type — Flash
Family — HCS08 (S08AW)

Datenblätter & Ressourcen

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