MC9S08DZ128CLF vs S9S08DZ60F2MLHR Vergleich
Detaillierter Direktvergleich von MC9S08DZ128CLF von NXP Semiconductors und S9S08DZ60F2MLHR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DZ128CLF | S9S08DZ60F2MLHR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,92 | $4,08 |
| Core | HCS08 (8-bit) | — |
| CPU Frequency | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| EEPROM | 2 KB | [DATA_NEEDED: exact value] |
| RAM | 8 KB | 2 KB [DATA_NEEDED: exact value] |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40C to +85C (industrial) | — |
| I/O Pins | 40 | — |
| ADC | 12-bit, 24-channel, 2.5 us conversion | 12-bit SAR [DATA_NEEDED: channel count] |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| Communication Interfaces | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN | — |
| Timers/PWM | 6-channel PWM timer module | — |
| Gehäuse | 48-LQFP (7x7 mm), 0.5 mm pitch | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount | Surface Mount |
| Debug Interface | On-chip BDM (single-wire background debug) | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant (per distributor listings) |
| Core Architecture | — | HCS08 (S08) 8-bit CISC |
| Maximum CPU Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| Operating Voltage Range | — | 2.7 V to 5.5 V |
| Pin-Anzahl | — | 64 |
| Betriebstemperaturbereich | — | -40C to +125C (automotive) |
| CAN Controller | — | 1 x CAN 2.0 A/B (MSCAN) |
| LCD Driver | — | Yes, integrated segment LCD driver |
| AEC-Q100 Qualification | — | Yes (automotive grade) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED] |