MC9S08DZ60ACLF vs MC9S08DZ32ACLF Vergleich

Detaillierter Direktvergleich von MC9S08DZ60ACLF von NXP Semiconductors und MC9S08DZ32ACLF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter MC9S08DZ60ACLF MC9S08DZ32ACLF
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $6,85 $3,74
Core HCS08 (8-bit CISC) HCS08 (S08) 8-bit CPU
Core Frequency 40 MHz (20 MHz bus) —
Program Memory (Flash) 60 KB (60K x 8) 32 KB
RAM 4 KB 2 KB
EEPROM / Emulated EEPROM Available (size [DATA_NEEDED: EEPROM size]) —
Operating Voltage 2.7 V to 5.5 V —
Supply Rails 3.3 V / 5 V —
ADC 24-channel, 12-bit, 2.5 us conversion 24-channel, 12-bit, 2.5 us conversion
CAN 1 x CAN 2.0 A/B MSCAN (CAN 2.0 A/B)
LIN Master LIN 2.0 interface —
Communication Peripherals SCI (SPI), IIC, MSCAN —
Timer / PWM Channels Multiple (count [DATA_NEEDED: timer/PWM channel count]) —
LCD Driver Yes (on-chip segment LCD driver) —
Gehäuse 48-LQFP (7x7 mm) 48-pin LQFP (7x7 mm)
Betriebstemperatur -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] -40C to +85C (automotive grade available)
Montageart Surface Mount Surface Mount
MSL-Level MSL 3 (per JEDEC J-STD-020) [DATA_NEEDED: MSL level]
RoHS-Status Compliant [DATA_NEEDED]
Background Debug Mode (BGND) Yes (on-chip emulation/debug) —
Instruction Set HC08 instruction set with added BGND instruction HC08 with BGND added
Maximum CPU Frequency — 40 MHz (20 MHz bus)
EEPROM — On-chip (size [DATA_NEEDED: exact EEPROM size])
Versorgungsspannung — 2.7 V to 5.5 V (3.3 V / 5 V)
Analog Comparator — Yes (on-chip)
SCI / LIN — SCI with LIN master support
SPI — Yes (on-chip)
I2C — Yes (on-chip)
Interrupt Sources — Up to 32
Debug Interface — Background Debug Mode (BDM) / on-chip emulation

Datenblätter & Ressourcen

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