MC9S08GT16CFD vs MC9S08GT16ACFCE Vergleich

Detaillierter Direktvergleich von MC9S08GT16CFD von NXP Semiconductors und MC9S08GT16ACFCE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08GT16CFD MC9S08GT16CFD - 8-Bit 40MHz 16KB Flash MCU | NXP

MC9S08GT16CFD - 8-Bit 40MHz 16KB Flash MCU | NXP

MC9S08GT16CFD Unknown
NXP Semiconductors
MC9S08GT16ACFCE MC9S08GT16ACFCE - 40MHz HCS08 8-bit MCU, 16KB Flash | NXP

MC9S08GT16ACFCE - 40MHz HCS08 8-bit MCU, 16KB Flash | NXP

MC9S08GT16ACFCE Nrnd

Spezifikationsvergleich

Parameter MC9S08GT16CFD MC9S08GT16ACFCE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Unknown NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $2,31
CPU Architecture 8-bit HCS08 CPU —
Maximum CPU Frequency 40 MHz 40 MHz
Flash Memory 16 KB —
Flash Organization 16K x 8 —
Instruction Set HC08 instruction set with added BGND instruction HC08 with BGND
Interrupt or Reset Sources Up to 32 sources —
General-Purpose I/O 38 general-purpose I/O pins identified in retrieved technical data —
Port Pullups Software selectable on ports when used as inputs —
RESET Pullup Internal pullup identified in retrieved technical data —
IRQ Pullup Internal pullup identified in retrieved technical data —
Package Type 48-QFN-EP —
Package Dimensions 7 mm x 7 mm —
Package Code HVQCCN —
Terminal Count 48 terminals —
Terminal Form No lead —
Temperature Grade Industrial —
Device Class Embedded microcontroller —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Status [DATA_NEEDED: AEC-Q100 qualification status] —
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
RAM [DATA_NEEDED: RAM size] —
ADC [DATA_NEEDED: ADC specification] 10-channel 12-bit [DATA_NEEDED: full ADC spec block]
Timer Resources [DATA_NEEDED: timer resources] —
Communication Interfaces [DATA_NEEDED: communication interfaces] —
MSL [DATA_NEEDED: moisture sensitivity level] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Core — HCS08 (enhanced S08)
Core Size — 8-bit
Program Memory Type — Flash
Program Memory Size — 16 KB (16K x 8)
RAM Size — 2 KB (2K x 8)
Supply Voltage (Vcc/Vdd) — 1.8 V to 3.6 V
Betriebstemperatur — -40C to +85C (TA)
Number of I/O — 34
Gehäuse — 32-HVQFN (5x5 mm) with exposed pad
Montageart — Surface Mount
Peripherals — LVD, POR, PWM, WDT
Connectivity — I2C, SCI, SPI
Interrupt Sources — Up to 32
Lifecycle Stage — Not Recommended for New Designs (NRND)

Datenblätter & Ressourcen

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