MC9S08PT8VWJ vs MC9S08PT16VTJ Vergleich

Detaillierter Direktvergleich von MC9S08PT8VWJ von NXP Semiconductors und MC9S08PT16VTJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08PT8VWJ MC9S08PT8VWJ - 8-bit S08 MCU, 8KB Flash, 20-SOIC | NXP

MC9S08PT8VWJ - 8-bit S08 MCU, 8KB Flash, 20-SOIC | NXP

MC9S08PT8VWJ Nrnd
NXP Semiconductors
MC9S08PT16VTJ MC9S08PT16VTJ - 8-Bit S08 MCU, 16KB Flash, 20MHz | NXP

MC9S08PT16VTJ - 8-Bit S08 MCU, 16KB Flash, 20MHz | NXP

MC9S08PT16VTJ Nrnd

Spezifikationsvergleich

Parameter MC9S08PT8VWJ MC9S08PT16VTJ
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,76 $1,89
Core Processor S08 (HCS08) 8-bit CISC —
Core Size 8-Bit —
Speed 20 MHz —
Flash Memory 8 KB (8K x 8) —
EEPROM Integrated on-chip 256 B
RAM Size [DATA_NEEDED: RAM size] —
Versorgungsspannung 3.3 V / 5 V 2.7 V to 5.5 V
Gehäuse 20-SOIC (0.295 inch, 7.50 mm width) 20-TSSOP
Montageart Surface Mount Surface Mount
Operating Temperature Grade Industrial —
Peripherals Touch Sensing Interface (TSI), FlexTimer (motor control), EEPROM —
Safety Standard IEC 60730 (appliance safety, S08P family) —
Packaging Tube —
Terminal Form Gull Wing —
Number of Terminals 20 —
Package Code Family SOIC (SSOP-class rectangular package per Partstack listing) —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Lebenszyklusstatus NRND (Not Recommended for New Designs) per NXP product page NRND (Not Recommended for New Designs)
Core Architecture — S08 (HCS08L) 8-bit CISC
Program Memory (Flash) — 16 KB (16K x 8)
RAM — 2 KB
Maximum CPU Frequency — 20 MHz
Betriebstemperatur — -40 °C to +105 °C
Number of I/O — 17 (approx., per TSSOP-20)
ADC — 10-bit, multiple channels
Touch Sensing Interface (TSI) — Yes, integrated
FlexTimer (PWM) — Yes, motor-control optimized
Communication Interfaces — UART, SPI, I2C
Interrupt Sources — Up to 40
Nested Interrupts — Up to 4 levels
Debug Interface — Background Debug Mode (BDM)
Low-Power Modes — Run / Wait / Stop (low-uA)

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