MC9S08QG4CDNE vs MC9S08QG8MDNE Vergleich
Detaillierter Direktvergleich von MC9S08QG4CDNE von NXP Semiconductors und MC9S08QG8MDNE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QG4CDNE | MC9S08QG8MDNE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Product Type | 8-bit HCS08 microcontroller | 8-bit S08 microcontroller |
| CPU Architecture | S08 core with HCS08 instruction set | — |
| Maximum Clock Speed | 20 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Port Count | 6 ports | — |
| Gehäuse | 8-pin SOIC | 8-pin SOIC, MS-012AA |
| Package Reference | MS-012AA | — |
| Montageart | Surface mount | — |
| Instruction Set | HCS08 with added BGND instruction | — |
| Debug Support | Background debugging system with breakpoint capability | Background debugging system with breakpoint capability |
| Architecture Family | S08QG | — |
| Product Category | Microcontroller IC | — |
| RoHS-Status | RoHS compliant | RoHS compliant |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM capacity] | — |
| EEPROM | [DATA_NEEDED: EEPROM capacity] | — |
| ADC | [DATA_NEEDED: ADC specification] | — |
| Timer | [DATA_NEEDED: timer specification] | — |
| Serial Interfaces | [DATA_NEEDED: serial interface details] | — |
| Maximum I/O Frequency | [DATA_NEEDED: maximum I/O frequency] | — |
| CPU Clock Speed | — | 20 MHz |
| Program Memory | — | 8 KB Flash |
| Memory Organization | — | 8K x 8 bits |
| I/O Ports | — | 6 |
| Package Type | — | SOIC-8 |
| Terminal Count | — | 8 |
| Architecture | — | HCS08 with HC08 instruction set and added BGND instruction |
| Process Technology | — | CMOS |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Data Memory | — | [DATA_NEEDED: data memory size] |
| Peripheral Set | — | [DATA_NEEDED: complete peripheral list] |