MC9S08SE8MTG vs MC9S08SH4MTG Vergleich
Detaillierter Direktvergleich von MC9S08SE8MTG von NXP Semiconductors und MC9S08SH4MTG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08SE8MTG | MC9S08SH4MTG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,74 | $4,00 |
| Core | S08 (HCS08 CISC) | — |
| Datenbusbreite | 8 bit | — |
| Program Memory Size | 8 KB (8K x 8) Flash | — |
| RAM Size | 512 B | — |
| Maximale Taktfrequenz | 20 MHz | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Betriebstemperaturbereich | -40 C to +125 C | — |
| ADC | 10-bit on-chip | — |
| Number of I/O Pins | 14 | — |
| Gehäuse | 16-pin TSSOP | 16-TSSOP (0.173", 4.40mm width) |
| Montageart | Surface Mount | Surface Mount (gull-wing terminals) |
| Montagestil | SMD/SMT | — |
| Series | MC9S08SE | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Timers | Multiple 16-bit | — |
| Watchdog Timer | Yes (COP) | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS-Status | Compliant | — |
| Core Processor | — | HCS08 (S08 core) |
| Core Size | — | 8-bit |
| Maximum CPU Frequency | — | 40 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 512 B |
| Instruction Set | — | HC08 with added BGND instruction |
| Interrupt/Reset Sources | — | Up to 32 |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 12-channel |
| ADC Conversion Time | — | 2.5 us |
| Analog Comparator | — | Yes |
| On-chip Temperature Sensor | — | Yes |
| Operating Voltage Range | — | 2.7 V to 5.5 V (3.3V/5V operation) |
| Family Compatibility | — | Pin, tool and software compatible with S08SG |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |