MC9S08SH16MTJ vs MC9S08SH32MTJ Vergleich
Detaillierter Direktvergleich von MC9S08SH16MTJ von NXP Semiconductors und MC9S08SH32MTJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08SH16MTJ - 8-bit MCU 16KB Flash 40MHz | NXP Semiconductors
MC9S08SH16MTJ ✗ AbgekündigtNXP Semiconductors
MC9S08SH32MTJ - 8-bit 40MHz 32KB Flash MCU | NXP Semiconductors
MC9S08SH32MTJ ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC9S08SH16MTJ | MC9S08SH32MTJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,95 | $1,93 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (8-bit CISC) |
| Core Size | 8-bit | 8-bit |
| Maximale Taktfrequenz | 40 MHz | — |
| Flash Memory | 16 KB (16K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 1K x 8 |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 16-channel | — |
| Interrupt/Reset Sources | up to 32 | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Debug Interface | Single-wire background debug interface | Single-wire background debug (BDM), on-chip ICE with 2 comparators, 9 trigger modes, 8-deep FIFO |
| On-chip Debug Module | ICE, 2 comparators, 9 trigger modes, 8-deep FIFO | — |
| Betriebstemperatur | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 20-TSSOP (0.173 inch, 4.40 mm width) | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Packaging | Tube | Tube |
| Speed | — | 40 MHz |
| Program Memory Size | — | 32KB (32K x 8) Flash |
| Number of I/O | — | 17 |
| Versorgungsspannung | — | 3.3V / 5V |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| Peripherals | — | SCI, SPI, I2C, ADC |
| Gehäuse / Bauform | — | 20-TSSOP (0.173 inch, 4.40mm width) |
| Qualification | — | Automotive AEC-Q100 |
| Family Compatibility | — | Pin, tool and software compatible with S08SG family |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |