MC9S08SH4CTJ vs MC9S08SH8CTG Vergleich
Detaillierter Direktvergleich von MC9S08SH4CTJ von NXP Semiconductors und MC9S08SH8CTG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08SH4CTJ | MC9S08SH8CTG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,85 | $1,62 |
| Core Architecture | HCS08 (enhanced 8-bit) | — |
| CPU Bit Width | 8-bit | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor | 8-channel, 10-bit |
| Timers | MTIM, RTI, TPM (PWM) | — |
| Communication Interfaces | SCI/UART, SPI, I2C | — |
| Analog Comparator | Yes (integrated) | — |
| Gehäuse | 20-pin TSSOP | 16-pin TSSOP |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40 C to +85 C (industrial, TJ suffix implied) | — |
| Low-Power Modes | STOP, WAIT with fast wake-up | — |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | HC08 with BGND extension |
| Interrupt Sources | Up to 32 | — |
| RoHS-Status | Compliant | Compliant |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory Size | — | 8 KB (8K x 8) Flash |
| RAM Size | — | 512 B |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 13 |
| Connectivity | — | I²C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Betriebstemperaturbereich | — | -40°C to +85°C (industrial) |
| Data Retention | — | 10 years typical |