MC9S08SL16CTJ vs MC9S08SL8CTL Vergleich
Detaillierter Direktvergleich von MC9S08SL16CTJ von NXP Semiconductors und MC9S08SL8CTL von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08SL16CTJ | MC9S08SL8CTL |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,83 | $0,52 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| Maximum Clock Speed | 40 MHz | — |
| Program Memory Size | 16KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 256 x 8 | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | 16 | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Versorgungsspannung | 3.3 V / 5 V | 2.7 V to 5.5 V |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse | 20-TSSOP | 28-pin TSSOP |
| Packaging | Tube | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40 °C to +85 °C (Industrial) |
| Special Module | Embedded Slave LIN Interface Controller (SLIC) | — |
| Instruction Set | HC08 compatible with added BGND instruction | — |
| Part Status | Obsolete | — |
| Core | — | S08 (HCS08) 8-bit |
| Program Memory | — | 8 KB Flash |
| EEPROM | — | 512 Bytes |
| RAM | — | [DATA_NEEDED: RAM size] |
| Maximum CPU Frequency | — | 40 MHz |
| I/O Pins | — | 16 |
| ADC | — | 16-channel, 10-bit, 2.5 µs conversion |
| Timers | — | 16-bit TPM (Timer/PWM Module) |
| Serial Interfaces | — | IIC, SCI (UART), LIN via SLIC + on-chip LIN PHY |
| LIN Physical Layer | — | Integrated, LIN 2.1 / SAE J2602 compliant |
| Interrupts | — | Up to 32 sources |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| RoHS-Status | — | Compliant |
| Process Technology | — | 0.25 µm CMOS |
| Debug Interface | — | Background Debug Mode (BDM) |